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Send EmailCopper–Nickel Master Alloy, 7440‑50‑8, 7440‑02‑0
Product: Copper–Nickel Master Alloy (30Ni / 50Ni)
Product Name: Copper–Nickel Master Alloy
Grades: CuNi30 (30Ni), CuNi50 (50Ni)
Form: Solid ingot / Master alloy
Intended Use: An intermediate alloy designed for the controlled addition of nickel into copper-based melt systems.
| Grade | Cu (%) | Ni (%) | CAS Numbers |
|---|---|---|---|
| 30Ni | ~70 | ~30 | Copper: 7440‑50‑8, Nickel: 7440‑02‑0 |
| 50Ni | ~50 | ~50 | Copper: 7440‑50‑8, Nickel: 7440‑02‑0 |
Values are given in weight percent (wt. %) unless otherwise stated. Exact composition may vary slightly by production batch.
| Element | CuNi30 (wt. %) | CuNi50 (wt. %) |
|---|---|---|
| Copper (Cu) | Balance (~70) | Balance (~50) |
| Nickel (Ni) | 30.0 ± 1.0 | 50.0 ± 1.0 |
| Iron (Fe) | ≤ 0.50 | ≤ 0.50 |
| Manganese (Mn) | ≤ 0.50 | ≤ 0.50 |
| Silicon (Si) | ≤ 0.15 | ≤ 0.15 |
| Carbon (C) | ≤ 0.05 | ≤ 0.05 |
| Sulfur (S) | ≤ 0.02 | ≤ 0.02 |
| Phosphorus (P) | ≤ 0.02 | ≤ 0.02 |
| Other, total | ≤ 0.20 | ≤ 0.20 |
Note: Trace impurity levels are minimized through the use of high-purity raw materials and controlled production processes.
| Property | CuNi30 | CuNi50 |
|---|---|---|
| Appearance | Silver-grey metallic ingot | Silver-grey metallic ingot |
| Density (at 20 °C) | ~8.93 g/cm³ | ~8.94 g/cm³ |
| Liquidus Temperature | 1533 K (1260 °C) | 1593 K (1320 °C) |
| Solidus Temperature | 1493 K (1220 °C) | 1563 K (1290 °C) |
| Melting Range | 1220–1260 °C | 1290–1320 °C |
| Thermal Conductivity (RT)¹ | ~40 W/m·K | ~25 W/m·K |
| Electrical Conductivity (%IACS)¹ | ~5–7 | ~3–4 |
¹ Typical values for reference only. The master alloy is not intended for direct electrical or thermal conductor applications.
These master alloy ingots are specifically engineered for remelting and alloying purposes only, not for structural load-bearing applications. In the as-cast condition:
Hardness: Brittle nature; impact resistance is low at room temperature.
Tensile Strength / Elongation: Standard tensile testing is not applicable due to the non-homogeneous as-cast structure. Ductility is negligible.
Wear Resistance: Not evaluated for structural part service.
The brittle character does not impede dissolution or homogeneous distribution when added to a liquid metal bath.
The Copper–Nickel master alloy enables precise and homogeneous nickel additions in the following sectors:
Casting Alloys: For improved strength, corrosion resistance, and elevated-temperature properties (e.g., Cu-Ni-Zn, Cu-Ni-Sn alloys).
Electrical/Electronic Alloys: In resistance materials and heating wires where conductivity-resistivity balance is critical (e.g., CuNi44, Constantan-type alloys).
Marine & Industrial Alloys: For production of cupronickels (90/10 and 70/30) with superior seawater corrosion resistance.
Specialty Welding Consumables: Manufacturing of low-melting copper alloy welding wires.
Coinage & Medal Alloys: For precise nickel adjustment in white-copper based alloys.
Homogeneous Distribution: Nickel is uniformly dispersed within the copper matrix; micro-segregation is minimal.
Stable Melting Range: A narrow solidus-liquidus interval ensures rapid melting and consistent solidification, improving alloying control.
High Purity: Low inclusion and gas content enhances final alloy quality and reduces casting defects.
Ease of Use: Quick dissolution in standard induction furnaces and crucibles; negligible oxidation losses.
Cost Efficiency: High nickel content enables small addition quantities to reach target compositions, saving storage and material costs.
Storage:
Keep in a dry, covered area.
Store on pallets, avoiding direct contact with the ground.
Retain original packaging as long as possible to prevent surface oxidation from moisture/condensation.
Operational Guidelines (Melting):
Preheating: Preheat cold ingots to 100–150 °C before adding to the melt bath to remove moisture and prevent thermal shock.
Addition Method: Add directly into the liquid copper or copper alloy bath. Stirring promotes dissolution.
Temperature Control: Maintain bath temperature 100–200 °C above the liquidus point of the grade being used (e.g., ~1450–1500 °C for CuNi50). Avoid excessive superheating.
Protective Cover: To reduce oxidation, use a cover of dry charcoal, graphite powder, or a proprietary flux.
Contamination Prevention: Do not mix with iron, aluminum, or other non-ferrous scrap. Keep tools and crucibles clean.
Standard: Ingots of approximately 5–10 kg each, easily stackable. Shipped on pallets with shrink wrap or steel banding.
Custom Options: Different ingot sizes, granules, or waffle plate forms are available upon request.
Each pallet is labelled with grade, heat number, net weight, and identification of the manufacturing origin (without brand name).
In solid form and under normal handling and storage conditions, this product is non-hazardous.
During Melting Operations:
Ventilation: Use local exhaust or general dilution ventilation to keep metal fumes (particularly nickel compounds) below occupational exposure limits.
Personal Protective Equipment (PPE):
Heat-resistant gloves, protective clothing/apron.
Face shield or indirectly vented safety goggles.
Respiratory protection with appropriate particulate/fume filter if ventilation is insufficient.
Firefighting: The product itself is non-combustible. Use extinguishing media appropriate for surrounding materials (water mist, dry chemical, CO₂). Never apply water directly to molten metal – risk of steam explosion.
First Aid:
Skin Contact (hot metal): Immediately cool with plenty of cold water; seek medical attention. Solid ingot contact is neutral.
Eye Contact (dust/particles): Rinse thoroughly with water; seek medical advice.
Ingestion: Unlikely in solid form; nevertheless consult a physician.
Always comply with local occupational health and safety regulations.
The values presented in this Technical Data Sheet represent typical information compiled from current production data; they do not constitute a specification guarantee. Performance testing for specific applications remains the user’s responsibility. No liability is assumed for misuse of the product or misinterpretation of this data. This document is provided without supplier identification; for supplier-specific details, please refer to the commercial documentation accompanying the product.